POSITION SUMMARY:

• To be responsible for the development of custom memory modules for leading edge, high-performance server and embedded applications.
• Provides the opportunity to work closely with customers, engineering, manufacturing and test groups.
• The job requires imaginative problem solving and ability to work independently and on multiple projects.

PRINCIPLE DUTIES AND RESPONSIBILITIES: (Describe the specific roles and responsibilities of the position)

• Create PCB component Footprints per IPC-SM-782 and manufacturer’s data sheets.
• Work with hardware engineers, other PCB designers and Manufacturing group to design new product or modify and sustain existing product.
• Creation of Multi-layer (4-16 layers) Stack-up. Creation of board outline mechanical & Keepout.
• Identify signal topologies & implementation of constraints (using Allegro Constraint manager)
• Component placement & Routing the PCB (including proficient routing of differential pairs and controlled impedance lines with tight length matching requirements)
• Documentation which include development of fabrication and assembly drawings
• Release of Gerber files and a complete PCB release package.
• Lead placement and post-layout review meetings and assist in other review meetings such as schematic and DFM review meetings.
• Remain on top of industry standards and technologies to integrate and update tools, as appropriate.

REQUIREMENTS:(Set out the qualifications, experience & functional skills/competencies that are essential for the position)

Mandatory Requirements

Minimum Education: BS in Electronics preferred, or equivalent experience; MS is a plus.

Experience

• 5~10 years of experience in the PCB design field
• 5~10 years of experience in Cadence Allegro & Orcad Capture Design tool experience
• Experience with High-Speed Digital System Design & High-Density Interconnect Design mythology.
• Experience with Power Supply Circuit Designs & Other Analog Circuits.
• Identify areas of innovation in memory design and experience with invention disclosure and patent process.

Qualification

• The ability to read and understand component manufacturer’s data sheets.
• Excellent internet research capabilities, and ability to interface with customers and understand requirements.
• A self-starter, highly motivated, with excellent organizational skills, and must have excellent communication skills both verbal & written.
• TOEIC 550+

Additional Preferences

• Working knowledge of JEDEC DDR3, DDR4 & DDR5 standards is a plus