Responsibilities:

• Develop new packages and processes to support new product launches on time. (50%)

• Carry out Packaging Design for new products, feasibility studies with Assembly subcons, Risk Assessments and develop Gantt charts for projects. (30%)

• Troubleshoot and Support production related packaging issues. (20%)

• Designing new packages, layout of lead frame and substrate panels.

• Run risk analyses for new product scenarios.

• Debug subcon production issues.

• Make design and process decisions to achieve best in class new product realization.

Minimum Qualifications:

• B.Sc. ENG. Preferably Masters with major in Materials Science or Electrical Engineering

• 8 to 10 years of experience working in packaging industry either for assembly subcon or as a designer in New Product Team

• Excellent analytical and trouble shooting skills with the ability to proactively solve issues

• Effective verbal and written communication to interface at all levels within the organization

• Strong sense of urgency to meet product requirements on schedule

• Experience in working with international and cross-functional teams

• AutoCAD package design is required. SolidWorks and Thermal simulations are plus.

• Proficiency in Microsoft Office™ products - Excel, Word, Visio, Power Point, Project